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PCB Fabrication Services
Why Choose PCBArise for PCB Fabrication Services
PCBArise provides PCB fabrication services for prototypes, small batches, and volume production. We support multilayer PCBs, HDI PCBs, flexible PCBs, rigid-flex PCBs, high-frequency PCBs, heavy copper PCBs, controlled impedance, and advanced surface finishes for global electronics companies.
We support quick-turn prototypes, small batches, and volume production for industrial, automotive, medical, IoT, communication, and power electronics applications.
Our PCB Fabrication Services
Advanced PCB Capabilities
● 1-layer to 60+ layer PCB fabrication
● HDI, rigid, flex, and rigid-flex PCBs
● High-frequency, heavy copper, and metal-core PCBs
● Blind/buried vias, microvias, and controlled impedance
Material Expertise
● FR-4 and high-Tg FR-4
● Rogers, Taconic, and other RF materials
● Aluminum, heavy copper, polyimide, ceramic, and specialty substrates
DFM Review Before Production
● Gerber, stack-up, and impedance review
● Drill, spacing, annular ring, and copper balance checks
● Manufacturability feedback before fabrication
Strict Quality Assurance
● AOI inspection and 100% electrical testing
● Impedance testing and microsection analysis when required
● IPC-A-600 Class 2/3 standards available
Fast Turnaround & Scalable Capacity
● Quick-turn prototypes
● Small-batch and pilot-run production
● Stable volume manufacturing
● Global delivery support
PCB Fabrication Process: From Gerber to Shipment
Understanding the PCB manufacturing process is crucial for ensuring quality and reliability in your electronic projects. Below is a comprehensive, step-by-step guide to how your design transforms into a physical board.
Multilayer, HDI, Flexible and Rigid-Flex PCB Solutions
We specialize in a wide range of printed circuit board technologies to meet your specific engineering needs.
Durable multilayer boards suitable for industrial, automotive, and consumer electronics. We provide high-precision fabrication ranging from standard FR-4 boards to complex multi-layer designs (up to 60+ layers). Our facilities are optimized for both quick-turn prototypes and high-volume production runs.
Featuring microvias, blind/buried vias, and fine lines for high-speed signal transmission. Essential for modern compact electronics.
Flexible circuits designed for compact devices, wearables, and dynamic flex applications. Our FPC solutions utilize high-quality Polyimide (PI) to ensure durability in tight spaces without sacrificing signal performance. Ideal for smartphones, tablets, and medical devices.
The best of both worlds: combining the durability of rigid boards with the adaptability of flexible circuits. Perfect for complex 3D packaging requirements, reducing the need for connectors and improving reliability in aerospace and military applications.
High-Frequency: Low-loss materials (Rogers, Taconic, Teflon) designed for RF and microwave applications where signal integrity is critical.
Superior thermal management solutions using Aluminum or Copper bases. Our MCPCBs are designed to dissipate heat efficiently, making them ideal for LED lighting, power supplies, and automotive electronics.
PCB Fabrication Capabilities Overview
Our standard capabilities cover the majority of industrial and commercial electronic requirements.
| Feature | Specification |
| Layer Count | 1 – 40 Layers |
| Base Material | FR-4 (Standard/TG170), Rogers, Polyimide (PI), Taconic, Aluminum, Teflon, Ceramic |
| Board Thickness | 0.1mm – 10.0mm (Standard: 1.6mm) |
| Min Trace Width /Spacing | 2.5mil / 2.5mil (0.0625mm / 0.0625mm) |
| Min Hole Size/strong> | 0.15mm (Mechanical Drill), 0.1mm (Laser Drill) |
| Max Aspect Ratio | 12:1 (Through Hole) |
| Surface Finish | OSP, ENIG, HASL Leaded, Lead-Free HASL, Immersion Tin/Silver, ENEPIG, Gold Fingers, Gold Plating, Hard Gold |
| Copper Thickness | 0.5oz – 12oz (Heavy Copper available) |
| Min BGA Pad Diameter | 8 mil |
| Solder Mask Color | Green (Standard), Black, Blue, Red, White, Yellow, Purple |
| Silkscreen Color | White, Black, Yellow |
| Impedance Control | ±5% Tolerance |
Multilayer PCB and HDI PCB Fabrication Capabilities
For projects requiring cutting-edge technology and tighter tolerances, our advanced line delivers.
| Feature | Specification |
| Layer Count | Up to 60+ Layers |
| Board Thickness Tolerance | ±0.05mm |
| Min Trace Width /Spacing | 2mil / 2mil (0.05mm) |
| Min Hole Size | 0.1mm (Mechanical Drill), 0.075mm (Laser Drill) |
| Max Aspect Ratio | 15:1 (Through Hole) |
| Surface Finish | ENIG (Gold thickness 1u”-3u”), ENEPIG, Hard Gold (up to 50u”), Silver, OSP |
| Impedance Control | ±3% Tolerance (Strict) |
| HDI Technology | Any-Layer HDI, Stacked & Staggered Vias, Via-in-Pad |
| HDI Builds | 1+N+1 to 4+N+4, Any Layer Interconnection |
| Thermal Conductivity | Aluminum PCB up to 3.0 W/m.k |
Flexible PCB and Rigid-Flex PCB Fabrication Capabilities
Our FPC expertise includes dynamic flexing up to 200,000 cycles, and customization in shielding layers, stiffeners, ZIF connectors, surface mount components.
| Feature | Specification |
| Circuit Types | Single-sided, Double-sided, Multilayer, Rigid-Flex |
| Layer Count | 1 – 12 Layers |
| Material Options | Flexible: Polyimide (Kapton), PET, LCP Rigid: High Tg FR-4 (for rigid sections) Advanced materials available on request |
| Board Thickness | Flexible Area: 0.1mm – 0.6mm Overall / Rigid-Flex: Up to 3.2mm |
| Copper Weight | 1/3 oz to 2 oz (12µm to 70µm) |
| Minimum Trace/Spacing | Standard: 3/3 mil (0.076mm) Advanced: Down to 2/2 mil (0.051mm) |
| Minimum Hole Size | Laser Drilling: 0.1mm Mechanical Drilling: 0.15mm – 0.2mm |
| Surface Finish Options | ENIG (Standard for FPC), Immersion Tin, Immersion Silver, OSP, Selective Hard Gold |
| Coverlay Options | Polyimide + Epoxy (Yellow/Black/White), Photoimageable Coverlay, Flexible Solder Mask |
| Stiffener Options | FR-4, Polyimide (PI), Stainless Steel, Aluminum |
| Bending Radius | Static: 3-6x thickness Dynamic: 10-20x thickness |
| Dynamic Flex Capability | Designs optimized for >1 million flex cycles in controlled bend areas |
| Testing | 100% Electrical Testing, AOI Inspection, Dynamic Flex Testing, Custom Testing Available |
Lead Times by Product Complexity & Quantity
We offer flexible scheduling to meet your project deadlines, from rapid prototyping to mass production.
Standard Lead Time (Business Days):
| Product Type | Prototype (1-10 sqm) | Small Batch (10-50 sqm) | Mass Production (>50 sqm) |
| Double-Sided (2L) | 24-48 Hours | 3-5 Days | 7-9 Days |
| Multilayer (4-6L) | 48-72 Hours | 4-6 Days | 8-10 Days |
| Multilayer (8-12L) | 4-6 Days | 7-10 Days | 10-15 Days |
| Multilayer (12-18L) | 6-8 Days | 10-12 Days | 12-18 Days |
| Multilayer (18L+) | 7-12 Days | 12-15 Days | 15-20 Days |
| High-Density (HDI) | 7-12 Days | 12-15 Days | 15-20 Days |
| Flexible PCB (FPC) | 4-5 Days | 6-8 Days | 10-14 Days |
| Rigid-Flex | 7-10 Days | 10-14 Days | 15-20 Days |
Note: Specific lead times will be evaluated based on production data. Expedited services (Rush Order) are available for prototypes. Contact our sales team for specific requirements.
Get a PCB Fabrication Quote
● Fast quote response
● Free DFM review
● Prototype and volume production support
● No MOQ for prototypes
● NDA available
