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High-Quality PCB Manufacturing Capabilities
PCBArise offers PCB manufacturing capabilities for complex and high-reliability electronic applications. We support multilayer PCB, HDI PCB, flexible PCB, rigid-flex PCB, high-frequency PCB, heavy copper PCB, aluminum PCB, controlled impedance, blind and buried vias, microvias, and multiple surface finishes.
PCB Manufacturing Capabilities Overview
Our standard capabilities cover the majority of industrial and commercial electronic requirements.
| Feature | Specification |
| Layer Count | 1 – 40 Layers |
| Base Material | FR-4 (Standard/TG170), Rogers, Polyimide (PI), Taconic, Aluminum, Teflon, Ceramic |
| Board Thickness | 0.1mm – 10.0mm (Standard: 1.6mm) |
| Min Trace Width /Spacing | 2.5mil / 2.5mil (0.0625mm / 0.0625mm) |
| Min Hole Size | 0.15mm (Mechanical Drill), 0.1mm (Laser Drill) |
| Max Aspect Ratio | 12:1 (Through Hole) |
| Surface Finish | OSP, ENIG, HASL Leaded, Lead-Free HASL, Immersion Tin/Silver, ENEPIG, Gold Fingers, Gold Plating, Hard Gold |
| Copper Thickness | 0.5oz – 12oz (Heavy Copper available) |
| Min BGA Pad Diameter | 8 mil |
| Solder Mask Color | Green (Standard), Black, Blue, Red, White, Yellow, Purple |
| Silkscreen Color | White, Black, Yellow |
| Impedance Control | ±5% Tolerance |
Multilayer PCB and HDI PCB Capabilities
For projects requiring cutting-edge technology and tighter tolerances, our advanced line delivers.
| Feature | Specification |
| Layer Count | Up to 60+ Layers |
| Board Thickness Tolerance | ±0.05mm |
| Min Trace Width /Spacing | 2mil / 2mil (0.05mm) |
| Min Hole Size | 0.1mm (Mechanical Drill), 0.075mm (Laser Drill) |
| Max Aspect Ratio | 15:1 (Through Hole) |
| Surface Finish | ENIG (Gold thickness 1u”-3u”), ENEPIG, Hard Gold (up to 50u”), Silver, OSP |
| Impedance Control | ±3% Tolerance (Strict) |
| HDI Technology | Any-Layer HDI, Stacked & Staggered Vias, Via-in-Pad |
| HDI Builds | 1+N+1 to 4+N+4, Any Layer Interconnection |
| Thermal Conductivity | Aluminum PCB up to 3.0 W/m.k |
Flexible PCB and Rigid-Flex PCB Capabilities
Our FPC expertise includes dynamic flexing up to 200,000 cycles, and customization in shielding layers, stiffeners, ZIF connectors, surface mount components.
| Feature | Specification |
| Circuit Types | Single-sided, Double-sided, Multilayer, Rigid-Flex |
| Layer Count | 1 – 12 Layers |
| Material Options | Flexible: Polyimide (Kapton), PET, LCP Rigid: High Tg FR-4 (for rigid sections) Advanced materials available on request |
| Board Thickness | Flexible Area: 0.1mm – 0.6mm Overall / Rigid-Flex: Up to 3.2mm |
| Copper Weight | 1/3 oz to 2 oz (12µm to 70µm) |
| Minimum Trace/Spacing | Standard: 3/3 mil (0.076mm) Advanced: Down to 2/2 mil (0.051mm) |
| Minimum Hole Size | Laser Drilling: 0.1mm Mechanical Drilling: 0.15mm – 0.2mm |
| Surface Finish Options | ENIG (Standard for FPC), Immersion Tin, Immersion Silver, OSP, Selective Hard Gold |
| Coverlay Options | Polyimide + Epoxy (Yellow/Black/White), Photoimageable Coverlay, Flexible Solder Mask |
| Stiffener Options | FR-4, Polyimide (PI), Stainless Steel, Aluminum |
| Bending Radius | Static: 3-6x thickness Dynamic: 10-20x thickness |
| Dynamic Flex Capability | Designs optimized for >1 million flex cycles in controlled bend areas |
| Testing | 100% Electrical Testing, AOI Inspection, Dynamic Flex Testing, Custom Testing Available |
Lead Times by Product Complexity & Quantity
We offer flexible scheduling to meet your project deadlines, from rapid prototyping to mass production.
| Product Type | Prototype (1-10 sqm) | Small Batch (10-50 sqm) | Mass Production (>50 sqm) |
| Double-Sided (2L) | 24-48 Hours | 3-5 Days | 7-9 Days |
| Multilayer (4-6L) | 48-72 Hours | 4-6 Days | 8-10 Days |
| Multilayer (8-12L) | 4-6 Days | 7-10 Days | 10-15 Days |
| Multilayer (12-18L) | 6-8 Days | 10-12 Days | 12-18 Days |
| Multilayer (18L+) | 7-12 Days | 12-15 Days | 15-20 Days |
| High-Density (HDI) | 7-12 Days | 12-15 Days | 15-20 Days |
| Flexible PCB (FPC) | 4-5 Days | 6-8 Days | 10-14 Days |
| Rigid-Flex | 7-10 Days | 10-14 Days | 15-20 Days |
Note: Specific lead times will be evaluated based on production data. Expedited services (Rush Order) are available for prototypes. Contact our sales team for specific requirements.
Request a PCB Manufacturing Quote
● Fast quote response
● Free DFM review
● Prototype and volume production support
● No MOQ for prototypes
● NDA available
